Power and Cooling in the Envelope

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The envelope includes power and cooling. The seed matrix takes power_w; the outcome includes P_per_watt. ZettaFLOPS in real height and width inside a normal run of an IC wafer require the right ratio and the right envelope. Power and cooling are part of the specification.

The 7T seed delivers: any size chip (seed matrix + envelope), any kind of processing (classical, hybrid, photonic, quantum), and any zettaflop scale from the ratio. The rest is planned as a service—builds, harvests, foundry packages, Blu-ray, roadmap, and support.

Project 18 — AutoPhi Future. One vessel. 7T seed. Make way.

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