One Chip, Many Projections

The second embodiment in the consolidated patent application 19/540,453 is a unified processor product—internally referred to as AutoPhi Modern—that consolidates CPU, GPU, and data processors into a single “Complete Unit.” Rather than shipping separate processor lineages, the product is one architecture with multiple form-factor projections: MicroSDXC, PCIe, and socket. The same unit can be delivered as a card, a board, or a socketed part.

The Complete Unit provides a CPU domain and an accelerator domain in a single-chip (or equivalent) architecture. It incorporates nine technology elements and morphisms from prior branches (e.g., Scale 24–27, Quantum/REV 02/10/12/17, MicroSDXC 11). One handoff includes product documentation and a copy script that pulls all included projects into a single deliverable (e.g., an included_projects/ structure), so licensees or partners get a coherent tree of design and documentation.

Scale Tiers and Accelerator Domain

Scale tiers allow the same design to target different performance and cost points. The accelerator domain is where GPU and data-processing workloads live alongside the CPU, enabling a single package to serve general computing, graphics, and specialized data tasks. For embedded, edge, and data-center use cases, one SKU can replace multiple discrete parts.

This embodiment is fully described in the patent specification with reference to Figure 2 (isometric view of chip die, pin row, and exploded form-factor projections). The filing date of the overall portfolio is February 13, 2026; Application # 19/540,453 and Patent Center # 74480330 identify the case in all USPTO and licensee correspondence.

Source: US Patent Application 19/540,453, Section 8.2 and Claims.

Masonry view