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Foundry-Ready Semiconductor Design: From Seed to GDSII to Blu-ray Harvest
Not Just RTL—Deliverables That Foundries Accept
Two embodiments in application 19/540,453 are explicitly “foundry-ready”: the quantum battery (with GDSII generation tools) and the semiconductor seed matrix (with executable seeds through OpenLANE2 to GDSII and LEF, and harvest packaging including 25 GB Blu-ray). “Foundry-ready” means the design can be handed to a semiconductor foundry (e.g., TSMC, Samsung, Intel, SkyWater, GlobalFoundries) and processed into silicon—or at least to the point where the foundry has standard inputs (GDSII, LEF) to work with.
The seed matrix embodiment goes further: it defines formulas (S = H×W, N_v = S/a_v, C = N_v×f_v), voxel types (INTERCONNECT, LIGHT, BLANK, HYBRID, QUANTUM, IO, MEMORY, CROSS), and reproducibility (“same seed, same inputs, same result”). So the portfolio does not just claim “a chip”; it claims a method and system for producing buildable, versioned designs that scale to “any size chip” and “scalable FLOPS” (e.g., to zettaflop scale).
Investors and foundries want to see that a design is not stuck in a lab. Foundry-ready language and GDSII/LEF outputs signal that the inventor has taken the step from concept to manufacturable artifact. The patent ties that to a specific application (19/540,453) and filing date (February 13, 2026), so that any licensing or partnership discussion can reference a single, filed specification.
Source: US Patent Application 19/540,453, Sections 8.5, 8.15, and Claims 7, 10.
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