One Chip, Many Projections
The second embodiment in the consolidated patent application 19/540,453 is a unified processor product—internally referred to as AutoPhi Modern—that consolidates…
One Seed, Any Size Chip, Scalable FLOPS
The fifteenth embodiment in U.S. patent application 19/540,453 is the semiconductor seed matrix system—also referred to as 7T seed or AutoPhi Future…
Not Just RTL—Deliverables That Foundries Accept
Two embodiments in application 19/540,453 are explicitly “foundry-ready”: the quantum battery (with GDSII generation tools) and the semicond…
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